Faraday brings new IOT SoC platform to the fore—FIE3240 platform

Faraday Technology Corporation has brought the Faraday FIE3240 FPGA platform to the fore-a new addition to the SoCreative!™ IoT SoC platform series. The FIE3240 FPGA platform provides improved flexibility and scalability for modern AIoT SoC design using Arm® Cortex®-M series processors.
As Faraday vies to keep up with the customers' demand for a range of IoT application requirements, FIE3240 platform has apparently been equipped with industry-standard expansion interfaces to integrate Ethernet, USB, DDR, LCD controller, MIPI. The news has surfaced that multi-voltage I/O banks have been offered to connect several peripheral components.
FIE3240 also features PCle-to-PCle interconnection, thereby enabling the second SoCreative! FIE3240 or A500 platform associated through USB Type-C connectors to efficiently perform larger-scale SoC development. According to various reports, the SoC platform is fully advanced with pre-integrated software environment, such as software development kit, IDE tools, and secure boot function to aid customers trim development time and concentrate on their application algorithms.
Allen Chen, Senior Vice President of R&D at Faraday emphasized the development of complex chips and discussed the importance of scalable computing and connectivity for boosting complex chips in edge AI, IoT, smart meter devices, wearable and printer. He went on to elucidate that Faraday's new FIE3240 platform provides all of the major elements, allowing customers to expedite verification and software development to attain faster time-to-market in IoT-based systems.
Dipti Vachani, Senior Vice President and GM of Automotive and IoT line of Business at Arm, gave the mantra to achieve the vision of trillion connected devices and said developers require proven and scalable solutions that can be implemented quickly. She delineated the relevance of FIE3240 platform which would help Faraday's customers to simplify the Cortex-M based SoC development process that will expedite the delivery of low-power compute for an array of IoT applications.
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